SemiGrind Corporation is a wafer processing company which specializes in the removal of silicon from the back of wafers following conventional semiconductor processing. The company is primarily engaged in thinning wafers for commercial semiconductor wafer fabs. Wafers are first laminated using an automatic Taper made by Nitto-Denko. After inspection, they are placed on a Disco 84X series infeed Grinder. The appropriate grinder software program is then selected to ensure the proper terminal thickness is guaranteed. When all wafers have been processed, the lot is capacitance measured to provide the customers' Certificate of Compliance. After inspection, the wafers are detaped using Nitto-Denko Detaping tool. Final outgoing inspection is then carried out before the lot is prepared for shipment back to the customer. In addition to the core business, SemiGrind has expanded it's capability to explore ultra thin processing. 3M Corporation has installed their state-of-the-art "Wafer Support System"(WWS) in SemiGrind's cleanroom. The WSS acts to mount a processed wafer to a 700 micron thick concentric glass disk using 3M adhesives. Subsequent processing, i.e. thinning, stress relief, metallizations etc. can then be performed on the thinned (less than 20 microns available) wafer, nominally without fear of breakage. Finally, the wafer is automatically Demounted from the glass carrier and remounted onto UV dicing tape. The addition of the 3M tool set provides Semigrind’s customers access to state-of-the-art thinning technologies while additionally providing post-thinning processing capabilities while maintaining mechanical integrity.